Solder Profile Reflow Guidelines for Microsmt Cmpg Devices

Microchip Technology, Inc. provides these soldering profiles to aid users in properly assembling Microsemi CMPG devices onto printed circuit boards (PCBs). These reflow profiles are intended solely for classification and preconditioning purposes only; they do not specify the recommended board assembly profiles.

Relevant Information:

* All temperature values mentioned below refer to the topside of the package, measured on the package body surface.

* Time within 5°C of the classification temperature (Tc) is critical in determining solder profile requirements for Microsemi CMPG devices.

Typical Soldering Profile Conditions

The following table and corresponding graphical image illustrate the typical soldering profile conditions recommended by Microchip Technology, Inc. for use with Microsemi CMPG devices based on assembly materials and type:

| Profile | Feature |

| --- | --- |

| Pkg. Thickness <2.5 mm and Volume ≥350mm 3 | ... |

Reflow Profiling Details

Microsemi CMPG products are evaluated according to the IPC/JEDEC standard J-2600 for lead-free soldering surface finishes (SnPb eutectic process) or IEC 60748-7-2 for through-hole and surface mount device reflow profiles. For details on specific product-level requirements, consult Microchip's latest datasheet or contact a local sales representative.

Microsemi CMPG devices are designed to meet the soldering profile conditions specified in these guidelines. However, customer-specific applications may require additional testing beyond what is described here due to variations in assembly processes and materials used by customers. It is always recommended that users review Microchip's latest data sheets for any changes or updates before beginning production.

Microsemi CMPG devices are not guaranteed to function properly if soldered outside of the specified reflow profile conditions listed above, regardless of whether they pass a preliminary screening test(s). Customers must ensure their assembly processes meet these specifications and use only qualified components from Microchip Technology Inc. or its distributors for any volume applications.

For more information on product-specific reliability data sheets (PSS) or to request samples, please visit our website at 'Microsemi CMPG Website'.

Solder profile reflow